Fixing tie for hole (round), ⌀2.0-50.0mm, grey, 500pcs.
Art.-No. 157-00368 | T50ROSFT6SO25A-PA66HIRHS-GY

Offset design allows bundles to sit off of mounting points to avoid friction against surrounding areas.
Fir tree gives 3 to 1 extraction versus insertion force making them strong and easy to install.
Friction tab inside of fir tree allows tie to sit in mount without falling out prior to installation.

Package size

500 pcs.

3000 pcs.

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Brand Family	OS-Series
Color	Gray (GY)
Description	Offset cable ties route and position bundles away from a mounting hole. Rigid offset bar eliminates potential bending of wire or cables once installed. Multiple offset distances and fir tree sizes cover the majority of industry offset applications. The tie strap’s outside serration design provides a smooth surface to protect soft bundles. HellermannTyton’s one-piece mounting ties offer a complete solution by both bundling and mounting. Their ideal combination of high-specification materials and superior design suit the needs of complex applications.
Min. Tensile Strength (imperial)	50lbs
Min. Tensile Strength (metric)	225N
PART DESCRIPTION	T50ROSFT6SO25A-PA66HIRHS-GY
Packaging Type	pack
Part No.	157-00368
Product family	1-Piece Tie Assemblies
Product family	Fixing ties for holes
Short Desc.	1-Piece Cable Tie with Fir Tree Mount with Disc, 25mm Offset; 9.1"L, 6.1 - 7.0 mm or 6.35 mm (hexagonal) Hole, PA66HIRHS, Gray, 500/pkg
Type	T50ROSFT6SO25A
UV Resistant	No

Disc Diameter (imperial)	0.75"
Disc Diameter (metric)	19.0mm
Fixation Method	Fir tree for round holes
Height (imperial)	0.89"
Height (metric)	21.2mm
Identification Plate Position	none
Length (imperial)	9.1"
Length (metric)	230.0mm
Length 2 (imperial)	0.98"
Length 2 (metric)	25.0mm
Max. Bundle Diameter (imperial)	1.97"
Max. Bundle Diameter (metric)	50.0mm
Max. Hole Depth (imperial)	0.26"
Max. Hole Depth (metric)	6.65mm
Max. Mounting Hole Diameter (imperial)	0.28"
Max. Panel Thickness (imperial)	0.26"
Max. Panel Thickness (metric)	6.65mm
Min. Bundle Diameter (imperial)	0.08"
Min. Bundle Diameter (metric)	2.0mm
Min. Hole Depth (imperial)	0.02"
Min. Hole Depth (metric)	0.6mm
Min. Mounting Hole Diameter (imperial)	0.24"
Min. Panel Thickness (imperial)	0.02"
Min. Panel Thickness (metric)	0.6mm
Mounting Hole Diameter (imperial)	0.25 " (HEXAGONAL), 0.24 - 0.28 "
Mounting Hole Diameter (metric)	6.1 - 7.0 mm, 6.35 mm (hexagonal)
Mounting Hole Shape	Round
Offset Length (imperial)	0.98"
Offset Length (metric)	25.0mm
Panel Thickness (imperial)	0.02 - 0.26"
Panel Thickness (metric)	0.6 - 6.65mm
Releasable Closure	No
Width (imperial)	0.20"
Width (metric)	5.1mm

CE Certification	No
CSA Certified	No
Material	PA66HIRHS
Material	Polyamide 6.6, high impact modified, heat stabilized (PA66HIRHS)
Operating Temperature	-40°F to +221°F (-40°C to +105°C)
Operating Temperature, 1000h	+320°F (+160°C)
Operating Temperature, 5000h	+257°F (+125°C)
Operating Temperature, 500h	+329°F (+165°C)
Prop65 Warning	No
REACH Conformity	Yes
ROHS compliant	Yes
UL Listed (US and Canada)	No
UL Listed (US)	No
UL Recognized (US and Canada)	No
UL Recognized (US)	No