Fixing tie for hole (round), ⌀2.0-50.0mm, black, 1000Bag
Art.-No. 157-00199 | T50ROSFT612.5SOVC-PA66HIRHSUV-BK

An all-in-one bundling and fixing solution reduces costs.
High-specification materials and superior design suit the fixing and bundling needs of complex applications.

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Brand Family	OS-Series
Color	Black (BK)
Description	The Offset Cable Ties route and position wire and cable bundles away from a mounting hole. The offset bar between the fir tree and cable tie strap provides a robust and cored-out design to eliminate any potential bending of the wire or cable assembly once installed. The combination of 12.5mm and 25mm offset distances and various fir tree sizes offer coverage for a majority of industry offset routing application. The outside serrations of the tie strap present a smooth surface to the cables preventing any possible damage to soft or delicate bundles. One-piece mounting ties offer a complete solution by both bundling cable and at the same time providing a mounting solution. HellermannTyton’s one-piece mounting ties offer the ideal combination of high specification materials and superior design to suit the mounting and bundling needs of complex applications.
Min. Tensile Strength (imperial)	50lbs
Min. Tensile Strength (metric)	225N
PART DESCRIPTION	T50ROSFT612.5SOVC-PA66HIRHSUV-BK
Packaging Type	pack
Part No.	157-00199
Product family	1-Piece Tie Assemblies
Product family	Fixing ties for holes
Short Desc.	1-Piece Cable Tie with Fir Tree Mount, 12.5mm Offset, 0.24 - 0.27 " Mounting Hole, PA66HIRHSUV, Black, 1000/pkg
Type	T50ROSFT612.5SOVC
UV Resistant	Yes

Disc Diameter (imperial)	0.66"
Fixation Method	Fir tree for round holes
Identification Plate Position	none
Length (imperial)	9.4"
Length 2 (imperial)	0.49"
Length 2 (metric)	12.5mm
Max. Bundle Diameter (imperial)	1.97"
Max. Bundle Diameter (metric)	50.0mm
Max. Hole Depth (imperial)	0.20"
Max. Hole Depth (metric)	5.0mm
Max. Mounting Hole Diameter (imperial)	0.27"
Max. Panel Thickness (imperial)	0.20"
Max. Panel Thickness (metric)	5.0mm
Min. Bundle Diameter (imperial)	0.08"
Min. Bundle Diameter (metric)	2.0mm
Min. Hole Depth (imperial)	0.02"
Min. Hole Depth (metric)	0.6mm
Min. Mounting Hole Diameter (imperial)	0.24"
Min. Panel Thickness (imperial)	0.02"
Min. Panel Thickness (metric)	0.6mm
Mounting Hole Diameter (imperial)	0.24 - 0.27 "
Mounting Hole Diameter (metric)	6.1 - 6.9 mm
Mounting Hole Shape	Round
Offset Length (imperial)	0.49"
Offset Length (metric)	12.5mm
Panel Thickness (imperial)	0.02 - 0.20"
Panel Thickness (metric)	0.6 - 5.0mm
Releasable Closure	No
Width (imperial)	0.20"

CE Certification	No
CSA Certified	No
Material	PA66HIRHSUV
Material	Polyamide 6.6 high impact modified, heat and UV stabilized (PA66HIRHSUV)
Operating Temperature	-40°F to +221°F (-40°C to +105°C)
Operating Temperature, 1000h	+320°F (+160°C)
Operating Temperature, 5000h	+257°F (+125°C)
Operating Temperature, 500h	+329°F (+165°C)
Prop65 Warning	No
REACH Conformity	Yes
ROHS compliant	Yes
UL Listed (US and Canada)	No
UL Listed (US)	No
UL Recognized (US and Canada)	No
UL Recognized (US)	No